The MIC-733 is pre-integrated with NVIDIA® Jetson AGX Orin™, and is ideal for use in industrial AI applications. The MIC-733 design includes 4 x Gigabit Ethernet LAN ports, 1 x HDMI video, 4ch-DI, 4ch-DO, 2 x RS-232/RS-422/RS-485 (internal pin header reserved), 2 x external USB 2.0, 4 x external USB 3.2, 1 x internal Micro USB for system recovery, 2 x Mini PCIe (Signal: PCIe+USB), 1 x M.2 2280 (PCIe x4 NVMe), 1 x Micro SD card slot for a storage device, and 1 x M.2 3052. Additionally, MIC-733 supports iDoor and iModules for more integration flexibility.

 

Features

• Compact fanless design
• Embedded with NVIDIA® Jetson AGX Orin™ up to 275 TOPS
• Supports 4 x GbE (optional PoE), 4 x USB 3.2 Gen 2 (10 Gbit/s)
• Supports 2 x mPCIe, 2 x Nano SIM slots
• Supports Allxon 24/7 remote monitoring and OTA deployment; Azure Certified
• Devices

 

Specifications

Download MIC-733-AO specification (EN, .pdf)

Model	MIC-733-AO5A1	MIC-733-AO6A1
Processor
NVIDIA Jetson Series	AGX Orin 32G	AGX Orin 64G
CPU	8-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU, 2MB L2 + 4MB L3	12-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU, 3MB L2 + 6MB L3
GPU	1792-core NVIDIA Ampere GPU with 56 Tensor Cores, Maximum Operating Frequency: 930 MHz	2048-core NVIDIA Ampere GPU with 64 Tensor Cores] Maximum Operating Frequency: 1.3GH
Al Performance Reference	Up to 200 TOPs	Up to 275 TOPs
Memory	32GB 256-bit LPDDR5 DRAM	64GB 256-bit LPDDR5 DRAM
I/O
Ethernet	4 x 10/100/1000 Mbps (Optional PoE support, IEEE 802.3af/at)	4 x 10/100/1000 Mbps (Optional PoE support, IEEE 802.3af/at)
Display	HDMI (Max. resolution 3840x2160 @ 60Hz)	HDMI (Max. resolution 3840x2160 @ 60Hz)
USB	External: 2 x USB 2.0, 4 x USB 3.2 Gen 2 Internal: 1 x USB 2.0	External: 2 x USB 3.2 Gen 2, 1 x USB 2.0 Internal: 1 x USB 2.0 (by pin header)
Digital I/O	4-ch DI, 4-ch DO	4-ch DI, 4-ch DO
Power Switch	1 x Power ON/OFF Button	1 x Power ON/OFF Button
Serial Ports	2 x RS-232/422/485 (On-board pin header)	2 x RS-232/422/485 (On-board pin header)
OTG USB	1 x Micro USB	1 x Micro USB
Expansion
iModule (Optional)	1 x PCIe x8 (MIC-75M10-00A2)	1 x PCIe x8 (MIC-75M10-00A2)
Mini PCIe	2 x mPCIe (Signal: PCIe+USB)	2 x mPCIe (Signal: PCIe+USB)
SIM	2 x Nano SIM slots	2 x Nano SIM slots
M.2	1 x M.2 3052 (B-Key, Signal: USB)	1 x M.2 3052 (B-Key, Signal: USB)
TPM (Optional)	1 x TPM 2.0	1 x TPM 2.0
GMSL (Optional)	2-ch GMSL2.0 with FAKRA connectors	2-ch GMSL2.0 with FAKRA connectors
iDoor (Optional)	1 x iDoor bracket reserve	1 x iDoor bracket reserve
Storage
M.2	1 x M.2 2280 (M-Key, NVMe, Signal: PCIe x4)	1 x M.2 2280 (M-Key, NVMe, Signal: PCIe x4)
SD Card	1 x Micro SD slot	1 x Micro SD slot
Power
Mode	AT/ATX (Default AT)	AT/ATX (Default AT)
Input Voltage	9 ~ 36 VDC, 16-4A	9 ~ 36 VDC, 16-4A
Environment
Operating Temperature	-10 ~ +60 °C with 0.7 m/s airflow (MaxN mode)	-10 ~ +60 °C with 0.7 m/s airflow (MaxN mode)
Operating Humidity	95% @ 40 °C (non-condensing)	95% @ 40 °C (non-condensing)
Vibration	3Grms @ 5 ~ 500 Hz, random, 1 hr/axis	3Grms @ 5 ~ 500 Hz, random, 1 hr/axis
Shock	10G / 11 ms	10G / 11 ms
Mechanical
Dimensions (W x D x H)	Core Module: 192 x 230 x 87 mm Plus MIC-75M10: 192 x 230 x 111 mm	Core Module: 192 x 230 x 87 mm Plus MIC-75M10: 192 x 230 x 111 mm
Weight	4.5 kg	4.5 kg
Installation	Desktop / Wall mount	Desktop / Wall mount
BSP
Jetpack	Above 5.0	Above 5.0
Certifications
Certificate	UL/CB/CE/FCC/BSMI/CCC (No RED certification)	UL/CB/CE/FCC/BSMI/CCC (No RED certification)

*Depending on the installation situation and interface connection. Derating of max. operating temp. is possible when using the cellular LTE module. Please see the user documentation **Memory can be ordered with 64 GB instead of the standard 32 GB (model: MIC-733-AO6A1).